Method of manufaturing multilayer printed circuit board

  • Inventors:
  • Assignees: Fujitsu Ltd
  • Publication Date: April 18, 1980
  • Publication Number: JP-S5553495-A

Patent Citations (0)

    Publication numberPublication dateAssigneeTitle

NO-Patent Citations (0)

    Title

Cited By (2)

    Publication numberPublication dateAssigneeTitle
    JP-H0546996-B2July 15, 1993Nippon Electric Co
    JP-S6313395-AJanuary 20, 1988Nec CorpManufacture of multilayer printed interconnection board